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TIN PLATED COPPER FOIL

1.       Product: copper conductive adhesive
2.       Backing material: Cu (99.95%)
3.       Thickness of backing: 0.1 mm
4.       Total thickness: 0.135 mm
5.       Heat durability: -10 - 120℃
6.       Tensile strength: 4.8 kg/mm
7.       Elongation: 3-4%
8.       Adhesive component: conductive acrylic


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Contact :SHENZHEN VANLEAD TECHNOLOGY CO., LTD

Phone :0086-755-88373799

Email :dyang@vanleadtech.com

Add : B Block, Buxin Building, Dongxiao Rd, Luohu District, Shenzhen City, Guangdong province, China