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COPPER FOIL

  • STD COPPER FOIL

  • Usage: Suitable for both internal and external parts of copper foil in multi-layer wiring board (FR-4)Characteristics: High tensile and ductile competence, good bonding strength, heat resistance and corrosion resistance.

COPPER FOIL(图1)                          COPPER FOIL(图2)

           surface before processing                                                           surface after processing 

Specification Thickness
um
12
18
35
50
70
105
140
Tensile Strength
N/cm2
34000
35000
37000
36000
37500
37500
37000
Elongation
%
5.2
5.5
7.3
7.5
7.5
7.6
7.5
Peel Strength
kgf/cm
1.1
1.38
1.85
1.95
2.15
2.38
2.54
Area Weight
g/m2
107
154
287
446
570
875
1000
Chemical Resistance
10%HCl 3.3mm%
1.0
1.0
1.5
3.5
4.2
5.5
6.0
Roughness Level
Shiny Surface Ra
0.30
0.32
0.35
0.35
0.35
0.34
0.36
Matte Surface Rz
4.0
4.5
10
10.1
15.2
20.1
22.3

  • HTE COPPER FOIL

  • Usage: Suitable for the internal part of copper foil for multi-layer wiring board (FR-4)
    Characteristics: High heat tensile and ductile competence, good bonding strength, heat resistance, corrosion resistance, anti-oxidization 

COPPER FOIL(图3)                                     COPPER FOIL(图4)

surface before processing                                                                surface after processing 


  • BATTERY COPPER FOIL

  • Usage: Suitable for negative electrode of lithium cell.

    Characteristics: High heat tensile and ductile competence, heat resistance.
    Variety:  one side matte; double side matte; double side roughness; double side shininess ( NEW!!!)



COPPER FOIL(图5)            COPPER FOIL(图6) 

               Matte side surface                                                 Shiny side surface 

Specification Thickness
um
9
10
12
18
Tensile Strength
N/cm2
32300
34400
34500
36000
Elongation
%
5.3
5.5
5.4
7.5
Area Weight
g/m2
85
95
108
150
Double Surface after processing copper foil
Roughness Level(Shiny Surface)
(um)
Shiny Surface Ra
0.29
0.31
0.31
0.35
Matte Surface Rz
1.35
1.38
1.42
1.45
Roughness Level(Matte Surface)
(um)
Shiny Surface Ra
0.42
0.42
0.45
0.47
Matte Surface Rz
2.65
3.18
3.33
3.84
Matt Surface after processing copper foil
Roughness Level(um)
Shiny Surface Ra
0.21
0.22
0.23
0.25
Matte Surface Rz
2.70
3.12
3.45
3.98


nothing NICKEL PLATED COPPER FOIL

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CONTACT US

Contact ：SHENZHEN VANLEAD TECHNOLOGY CO., LTD

Phone ：0086-755-88373799

Email ：dyang@vanleadtech.com

Add ： B Block, Buxin Building, Dongxiao Rd, Luohu District, Shenzhen City, Guangdong province, China